Fairchild Semiconductor's MicroFET™ Thin Package
targets battery-charging and power-multiplexing applications

Fairchild Semiconductor's (NYSE: FCS) MicroFET thin package helps designers avoid compromising their designs by providing them with an industry-leading low profile package. Working with design engineers and procurement managers, Fairchild developed an integrated P-Channel PowerTrench® MOSFET and Schottky diode, as a single-package solution to meet critical efficiency and thermal needs in battery charging and power-multiplexing applications. (Refer to picture on the right).

The FDFMA2P859T provides excellent power dissipation and conduction loss characteristics, compared to conventional MOSFETs, all while providing a 30 percent height reduction over the industry-standard 0.8mm MicroFET package. With a 0.55mm package height, this device is ideal for low profile designs, such as those common in the latest portable and wearable cell phones, media players and medical devices.

The customers design requirements for the FDFMA2P859T was for the device to provide exceptional thermal performance for its physical size, and to ensure a very low reverse leakage current (lr) of 1µA at Vr=10V, for the Schottky diode. These attributes are important in improving performance and efficiency in linear mode battery charging and power-multiplexing applications.

The FDFMA2P859T is part of Fairchild's extensive MOSFET portfolio designed to meet the efficiency, space and thermal needs of today's and future design challenges.

Fairchild Semiconductor in profile
Fairchild Semiconductor (NYSE: FCS) is a global leader delivering energy-efficient power analog and power discrete solutions. Fairchild is The Power Franchise®, providing leading-edge silicon and packaging technologies, manufacturing strength and system expertise for consumer, communications, industrial, portable, computing and automotive systems. An application-driven, solution-based semiconductor supplier, Fairchild provides online design tools and design centers worldwide as part of its comprehensive Global Power Resource^SM.

For further information on other products, design tools and sales contacts, view website: http://www.fairchildsemi.com

For product and company videos, listen to podcasts and comment , view website blog: http://www.fairchildsemi.com/engineeringconnections

New Metris XT V 130 X-ray inspection
system for electronics quality assurance

Metris' new compact, yet versatile XT V 130 x-Ray inspection system efficiently traces failures inside complex electronic devices and multilayer circuit boards. To maintain highest quality standards in an environment of continuous miniaturisation, electronics manufacturers prefer deploying intuitive, reliable and efficient X-ray imaging capability in house. The XT V 130 is a compact and affordable X-ray system for automated QA on serial-produced electronic samples.

Hidden electronic defects arisen during production or assembly generally result in system failure, fabrication, delay and additional cost. These defects can be detected efficiently early on in the process by taking An in-depth look at the inside of electronic specimens. Designed for high-throughput electronics X-ray inspection, the XT V 310 is a real QA workhorse that allows operators to provide instant pass/fail status. Automated inspection functions and (optional) automatic board identification ensure high inspection throughput rates. Inspection reports compliant with MRP systems facilitate tight integration into customers' manufacturing processes. Today . Any OEM and sub-system supplier of consumer, automotive, aerospace, medical and electronics can take advantage of X-ray inspection technology to get the job done!

Metris' new compact, yet versatile XT V 130 x-Ray inspection system.

Qualitative and robust X-ray imaging
The system comes withy a 30-130 kV open micro-focus X-ray source, a 4-axis programmable manipulator and a 16-bit imaging system based on a 4 inch image intensifier. A focal spot size down to 3 micron, 320x geometric magnification and tilt up to 60º offer excellent image quality and sufficient flexibility. A rotate stage and CT capability are available as an option. A hinged door provides easy access to the inspection area, which fits samples up to 40x35cm. Using qualitative real-time X-ray capabilities, operators intuitively navigate bthrough the layers of a PCB or inside electronic devices by changing position, angle and zoom as desired using the joystick. The XT V 130 system is ideally suited to quickly trace inconsistencies, connectivity issues, incomplete through-layer vias and other failures.

Intuitive and interactive image processing
The intuitive operation of the compact XT V 130 system is controlled by Inspect-X, the powerfull proprietory software used on all Metris XT systems. Inspect-X is known for its powerfull X-ray image processing and analysis as well as the broad set of automation capabilities that is included. Developed to streamline the inspection process with ultrafast X-ray acquisition, the XT V 130 runs first-article inspection in minutes, instead of hours or days.

Providing real value for money
Besides easy opersation, the Metris XT V 130 system offers low cost of ownership. The o;pen X-ray tube installed in the system allows for qick replacement of low-cost filaments. All serviceable are installed on a drawer that can be opened from the front, making the system very easy to service. Thanks to its footprint that is limited to 1m², a built-in generator and weight below 1150kg, the Metris XT V 130 system easily fits any electronics production area without requiring high-voltage powern or special floor conditions. The systems' protective enclosure puts safety first, avoiding the use of dedicated badges or protective clothing.

A complete range of electronic X-ray systems
In Metris' range of electronic X-ray systems, which originates from the renowned X-ray system manufacturer X-Tek, the XT V 130 is a QA workhorse machine with an optimum performance-price ratio. It ideally complements the top line XT V 160 system, previously named X-Tek Revolution, a powerful R&D and production engineering system featuring a superb nanotech 160kV X-ray source. The possibility to configure a flat panel imager enables the system to aquire images of the highest resolution. In addition, the XT V 160 offers CT capability, a market-leading 75º tilt angle and a standar4d rotate stage with true concentric imaging to readily reveal and resolve weak points in the PCB manufacturing process. Recently, the design of the top-line XT V 160 system has been further benhanced based on customer feedback, To obtain faster access to the inspevtion area and better viewing of the sample, the sliding window is replaced by a standard door and window combination. This modification also allows larger samples to be inserted into the system and provides easier access to the gun for filament changes. To simplify system operation, all controls have been centralised into a single easy-to-use panel. Furthermore, the sample manipulator has been strengthened further to make concentric movement of the sample even more accurate and stable.

Overall, Metris has a worldwide install base of approximately 1,500 X-ray and CT systems.

Nikon Metrology in profile
Nikon Metrology offers the most complete and innovative metrology product portfolio, including state-of-the-art 2.5D vision measuring systemscomplemented with optical and mechanical 3D metrology solutions. These reliable and innovative metrology solutions respond to the advanced inspection requirements of manufacturers active in consumer, automative, aerospace, electronics, medical and other industries. Systems are available in both fixed and portable configurations, equipped with  single or multiple sensors.

For further information, e-mail: Renaat.vancauter@nikonmetrology.com or view website: www.nikonmetrology.com   

Reflow soldering process compatible
to reduce process time and assembly costs

Molex Incorporated (NASDAQ: MOLX and MOLXA), one of the world's leading suppliers of interconnect products and solutions, introduces an innovative reflow soldering process compatible MOST Straight Junction Box. Automotive OEMs can achieve significant reductions in process time and assembly costs in their multimedia and infotainment networking product manufacturing by using the new Molex Straight Junction Box.

"The elimination of the wave soldering process has been recognised as the most important factor in increasing manufacturing efficiency and reducing the associated production costs of the MOST Junction Box. Molex has worked closely with leading automotive manufacturers to design and develop a reflow soldering process compatible alternative," said Padraig Franklin, product manager, Molex Incorporated. "Suitable for any infotainment application in both the Automotive and Non-Automotive Transportation industries, our new 91905 series Straight Junction Box complies with the MOST standard dimensions. The Junction Box contains 42 circuits, which allows OEMs to connect all their required multimedia devices using just one connector."

The housing for the new 91905 series Straight Junction Box is manufactured from a high-temperature PPA (Polyphthalamide) resin with superior heat distortion stability, making this product capable of withstanding reflow soldering process temperatures. Comprising 16 spade terminals for power, 2 fuse terminals and 24 square 0.61mm (.024") signal pins, the Molex MOST Straight Junction Box is the interface connector between the electronics of the vehicle multimedia interface module, which contains the stereo, GPS, DVD, phone and portable media player controls, and the harness that connects the speakers and amplifiers. Molex can also offer custom designed Right-Angle Junction Boxes with the same capability.

MOST stands for Media Orientated Systems Transport and is the standard for multimedia and infotainment networking in the automotive industry. Molex is part of the MOST Cooperation, which was set up in 1998 to design a common standard for the ever growing multimedia networking car entertainment and accessory system. MOST technology was designed to provide an efficient and cost-effective method of transmitting audio, video, data and control information between attached devices in the harsh environments of automotive applications. At the same time, it provides a unique quality of service required for the transmission of audio and video services.

For further information on the Molex Straight Junction Box and the full range of MOST products, view website: www.molex.com/product/most.html   Refer to page 113