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Electronic test solutions for electronic boards and modules

Electric test solutions for electronic boards and modules

Seica, a world leader in the design and manufacturing of electric test solutions for electronic boards and modules, offer its  Pilot V8 Flying Prober with automatic loader, the innovative in-circuit and functional line tester, Compact SL, and the model Top-bottom of Firefly Laser Selective Soldering. PILOT V8 (Automatic)

Pilot V8
is the only ATE flying prober with vertical architecture equipped with 8 drive/sense flying probes, two supply probes, two for the vectorless test, two cameras and two temperature sensors, able to execute in-circuit testing, functional testing, boundary  scan, optical and thermal scan on every kind of printed circuit board.

When used for testing new PCB from new production batches, Pilot V8 offer extremely high capabilities, thanks to the parallel test performance, allowing the test of two PCBs simultaneously, doubling productivity and offering test times comparable with the standard bed of nails tester against a major fault coverage and improved mechanical accessibility to the PCB itself.

When used for the repair of boards from the field,
Pilot V8 also allows the preliminary reverse engineering during testing, offering the possibility to reconstruct CAD project data and the wiring diagrams of the product to be tested, when these are not initially available for the preparation of the test program.

The new
Pilot V8 Automatic, designed for those who want to maximize the yield of PCB high volumes test, has a special conveyor for the automatic transport of the PCBs and, combined with an external loading/unloading warehouse, allows the use of the test system without a dedicated operator.

Compact SL: The new in-circuit and functional line testing system
Compact SL was inspired by WCM standards increasingly popular in the electronic boards manufacturing, with particular reference to automotive industry, where ergonomics, small size and easy maintenance are essential features which a good test system, robust, reliable and accurate, must have. The transportation of boards is ensured by an automatic "pass through" conveyor, fully managed by the VIVA operating system, a core of all SEICA ATEs, while the contact between the UUT and the test fixture is performed by means of a motorized press which is also fully automatic and programmable.

Compact SL is only 60 cm large, but embodies the power of a complete test system expandable to over 3000 channels, with the ability to perform analog, digital and power testing, but also optical testing if equipped with cameras and/or optical fibers for the inspection of LCD and luminescent LED.

Compact SL
uses the same mechanical adapter of the other manual system of the Compact line, with which it is able to share the same text fixtures and can accept till 4 independent JOBS for measures, favoring the simultaneous testing of maximum 4 UUT.
If configured for functional testing,
Compact SL can be provided with management software alternative to VIVA operative system, as Labview and TestStand by National Instruments, in order to allow standardization of test programs in the production plant.

Firefly
Seica is on the market for years with the Firefly, a system able to offer a simple and flexible solution of selective laser soldering. Project developments, dedicated along the years to improve and consolidate the "bottom"  version Firefly B60, are now shared with a new "top" system platform. The model "top" is available in version "top" (Firefly T60), with a soldering head from above or in version "top-bottom" (Firefly TB60) with 2 independent soldering heads. The machine is made of 2 autonomous modules, each one equipped with its own laser source.

The Firefly project philosophy aims to provide a solution where is required an integration of selective laser soldering on an existing production line, not necessarily compliant with the SMEMA specifications. The "top" module indeed connects to the "bottom" module (or to the customer's conveyor) through a defined interface, in both hardware and software.

Top soldering is widely used in the completion of pre-assembled modules, where irregular shapes force the manufacturer to use specific transport.

The laser technology in selective soldering, represents more a selection of process than of machine. The technology integrated into the Firefly soldering head, indeed, combined with an efficient software, allows to characterize a stable thermal profile for each solder joint.

Laser represents a flexible solution but at the same time repeatable and controllable: it's the solution for a process certification.

RTE-200 Boundary Scan
RTE-200 Boundary Scan is the perfect solution for those who wish to combine the performance of a powerful test system for functional analog test with those of a great Boundary Scan tester for digital components testing: compact size and standard 19" rack architecture allow the user to employ RTE-200 Boundary Scan as desktop independent system, or as a real tool to be integrated into a more complex apparatus aimed to test electronic equipment and not individual boards.

The software platform VIVA SEICA, which manages the functional ATE part, is perfectly integrated with the management software DIATEM by TEMENTO SYSTEMS, responsible of the testing part Boundary Scan, in order to write and execute a single test program which combines the part of functional and JTAG-type testing, thus optimizing the test time, maximizing the coverage of faults detectable by the tester and producing a single test report. Benefiting of VIVA and DIATEM platforms at the same time, RTE-200 Boundary Scan can be also equipped with in-circuit performances, like all SEICA systems, or for the programming of digital JTAG devices, characteristic of TEMENTO SYSTEMS products, as well as the innovative testing performance "at speed" which provides high-speed testing of memories (even 266 MHz) that is the same frequency of the memory controller.

For further information, view website: www.seica.com 

SOURIAU and PROTOKRAFT team to facilitate
ELIO® compliant optical network interconnections

Protokraft has introduced the Sabre Series of high speed optoelectronic solutions with Souriau´s ELIO® optical interfaces, to offer a high performance D38999 / ELIO® based optical component solution for avionics optical networks. These components are ideal for use in harsh environments where small size, weight reduction and significant levels of shock, vibration or extreme temperature ranges are experienced: military, aerospace, industrial or utility applications.

Protokraft has introduced the Sabre Series of high speed optoelectronic solutions with Souriau´s ELIO® optical interfaces.

Protokraft Sabre series high speed optoelectronic solutions consist of fiber optic transmitter or receiver functions integrated into an environmentally sealed D38999 shell with a Souriau ELIO® optical interface per ARINC 818, 801, 803 & 804. The Sabre series optoelectronic transmitters and receivers have an ELIO® 2.5mm ceramic optical fiber ferrule connector interface per EN 4531 and ABS 1213 & 1379 and are intermateable with Souriau ELIO® size 09-01 connectors.

They are suitable for optical communications applications from 125Mbps to 4.25Gbps, with optical fiber link distances up to 550 meters. They have an operating temperature range from -55°C to +85°C, and are shock, vibration and ESD resistant per Mil-Std-810 and DO-160. Aluminum alloy D38999 shells are strong, durable, corrosion resistant and light weight.

For further information, view website: www.souriau-industrial.com 
Refer to page 195

ADLINK Technology's high-reliability Intel® Atom™-based
rugged system is capable of operating in extreme temperature

ADLINK Technology Inc. offer a high-reliability Intel® Atom™-based rugged system. The Ampro by ADLINK™ RuffSystem™ 735 integrates a high-efficiency processor, RAM, graphics, networking, serial I/O, and PC/104-Plus expansion into an Extreme Rugged™ enclosure, capable of operating in extreme temperatures at full CPU speed.

The RuffSystem™ 735 is designed for ruggedness and reliability in mission critical applications where other systems would fail, such as military vehicles, transportation control, and field monitoring. The system excels in high vibration mobile applications. Leveraging Ampro by ADLINK™ Extreme Rugged™ boards and having no moving parts, these systems run reliably for years and years with absolutely zero maintenance. In remote mobile applications, this translates to mission success.

Designed from the ground up for use in harsh environments, the RuffSystem™ 735 integrates Extreme Rugged™ boards in a complete turnkey general purpose computer system, simplifying the system integration process and improving time-to-market. 

The RuffSystem™ 735 features a 1.6GHz Intel® Atom™ processor N270, up to 2GB of DDR2 RAM, and Intel® GMA 950 graphics core supporting display resolutions of up to 2048x1536 at 75Hz. A broad range of I/O includes one Gigabit and one Fast Ethernet port (dual GbE in Q3), four USB 2.0 ports, stereo audio, 4 serial ports (2 supporting RS232/422/485), and parallel port. Storage is provided by an internal conventional or solid state drive (SSD) via SATA interface and a CompactFlash® socket. The system also provides flexible expansion with PCI Express® Mini Card slot and PC/104-Plus interface. 

The Ampro by ADLINK™ MilSystem™ 735 will be available in Q2, 2010) provides the same level of ruggedness as the RuffSystem™ 735, but uses MIL-STD-D38999 connectors in place of the standard PC connectors found on the RuffSystem™.

Both systems are fanless, designed to meet MIL-STD-810 shock & vibration, and operate at full speed in an extended operating temperature range of -40 to 75°C.

The RuffSystem™ and MilSystem™ 735 are available at competitive prices with Ubuntu Linux 8.04 LTS or Windows® XP Professional preinstalled. The systems also support a full range of additional embedded and desktop operating systems, including VxWorks.

For further information, view website: http://www.adlinktech.com/ampro-extreme-rugged 
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THE JOURNAL OF INDUSTRY AND TECHNOLOGY  PAGE 141