A Seica SPA technological seminar was held on January 25th in Israel, at the Daniel Hotel in Herzliya, Tel Aviv. The event was organized by Spider Engineering, a representative and partner company of Seica in Israel.
Mr. Antonio Grassino, President of Seica, pointed out that the large number of participants that attended confirms the company's strategic choice of investing in the Israeli market; an investment which has already resulted in the sale and installation of two Pilot Line Flying Probers.
The 145 guests attending the seminar were shown an overview of the latest technological developments in the presentation "Technology challenges and test strategies". Reduced accessibility for test, the need to limit and certify the current and voltage values used during measurements, the need for increased performance in frequency measurements, combined with very high density circuits, all pose significant challenges to the conventional functional test techniques using connectors and to in-circuit, bed of nails test. This trend is amplified by the IoT (Internet of Things) which adds 3D components, a mix of electronic, optical and mechanical technologies, as well as new materials, thus making the application of conventional board testing increasingly difficult.
Boundary scan technology helps, but it is far from being able to provide a complete solution to the problem as a whole. The alternative proposal is to utilize a flying probe tester which integrates all of the resources required to provide a complete range of test solutions: for example power-on test and parallel functional channels applied directly by the mobile probes.
Seminar attendees saw a series of technological and solution-oriented presentations, which were alternated with real case applications directly reported by Israeli customers using Seica testers.
Among the most popular topics was the potential of vertical Flying Probers and boundary scan test integration. This builds on the well-established concept that flying probe systems provide excellent in-circuit test and can integrate all of the features and capabilities of a functional tester.
After an in-depth technical review of measurement and test technologies, the topics of Legacy Replacement and Reverse Engineering were discussed, along with the importance and benefits of double-side test capability. Again, these topics were illustrated with real case applications, implemented for Seica customers worldwide.
In addition to the technical information, Seica also presented the good financial results achieved by the group in 2015, the new strategies of the company, concerning territorial growth, and future technical and commercial goals. Particular emphasis was placed on the global service network provided by the parent company with its subsidiaries, ensuring worldwide, around-the-clock service.
Seica in profile
Founded in 1986, Seica S.p.A. is a global supplier of automatic test equipment and selective soldering systems, with an installed base of more than 1500 systems on 4 different continents. Seica offers a complete line of test solutions, including bed of nails and flying probe testers, able to perform MDA, in-circuit and full functional tests of assembled electronic boards and modules, and printed circuit boards, as well as laser-based selective soldering systems for electronic board manufacturing. Company headquarters are located in Strambino, Italy, with direct offices in France and USA, Germany and China, supported by a vast distribution network covering the rest of the world.
For further information, view website: www.seica.com